 | Prof. Jun WeiHarbin Institute of Technology (Shenzhen) Center for Flexible Printing Electronic Technology, China National Specialized Expert, Deputy Secretary-General of the Asia-Pacific Academy, Director of the Shenzhen Flexible Printing Electronics Technology Key Laboratory, and Director of the Flexible Printing Electronics Technology Center of Harbin Institute of Technology (Shenzhen). Before joining Harbin Institute of Technology (Shenzhen), Professor Wei Jun was the chief scientist of the Singapore Agency for Science, Technology and Research (A*STAR), one of the founders of Singapore's flexible printed electronics, and one of the founders of Singapore's additive manufacturing. He served as the vice president of research and international cooperation at the Singapore Institute of Manufacturing Technology (SIMTech), the director and project leader of the A*STAR Industrial Additive Manufacturing Theme Strategic Research Program, the project leader of the A*STAR Additive Manufacturing Center, the director of the "3D Additive Manufacturing" Joint Laboratory of SIMTech-Nanyang Technological University, the director of the "Large Area Flexible Hybrid Electronics" Joint Laboratory of SIMTech-Singapore National University, and the director of the Flexible Printed Electronics Research Laboratory at SIMTech. Having been engaged in fundamental and applied research on advanced manufacturing technologies for over 30 years, many of the research results have been applied by several top companies worldwide. More than 550 papers have been published in SCI journals, with over 33,000 citations. The Google Scholar H-index is 90. He has delivered over 400 speeches at international academic conferences and forums. He holds 80 public technologies and patents. He has served on the committees of several international conferences and journal editorial boards. |
 | Prof. Zhengchun YangThe University of Auckland, China Yang Zhengchun, Ph.D., Senior Engineer, graduated from the National University of Singapore. Currently, he is a professor at Tianjin University of Technology. He holds the position of Vice Dean of the Institute of Integrated Circuit Science and Engineering. He has been selected for the Young Project of the High-level Talent Introduction Program of Tianjin, the Young Project of the Special Appointment Professor of Tianjin, the Young Talents Cultivation Program for Middle-aged and Young Teachers of Tianjin Universities, the Young Science and Technology Excellent Talent of the Tianjin Innovation Program, and the 2018 Annual China-South Korea Young Scientists Exchange Program of the Ministry of Science and Technology. He also serves as the head of the Advanced Materials and Printed Electronics Team. He has conducted research at the National University of Singapore and Seoul University, participating in the research and development of carbon-based semiconductor materials and microelectronic storage devices, and has accumulated experience in the research and development of semiconductor materials, devices, and system integration. He has long been deeply engaged in the field of advanced semiconductor materials and device technologies, with research directions including carbon-based semiconductor material processes and devices, new energy devices and systems, advanced sensors and high-end equipment. He has led and participated in several longitudinal scientific research projects, including the National Natural Science Foundation of China, Tianjin Major Projects, Key Projects of Tianjin Natural Science Foundation, and the Special Support Program for Talent Development of Tianjin Universities - High-level Innovation and Entrepreneurship Teams. At the same time, he has also undertaken several lateral projects commissioned by enterprises such as the National Engineering Research Center for Oil Refining Technology and Catalysis, the Exploration and Development Research Institute of China National Petroleum Corporation, and Tianjin Zhongtian Kexi Technology Co., Ltd., demonstrating interdisciplinary engineering capabilities. |